s m a l l s i g n a l s w i t c h i n g d i o d e s reverse v oltage: 75 v olts power dissipation: 500 mw rohs device page 1 rev :b features -design for mounting on small surface. -high speed switching. -high mounting capability , strong surge withstand, high reliability . -also available in other standard case: cdsf4148/4448 - sod323f(1005) size cdsu4148/4448 - sod523f(0603) size mechanical data -case: minimelf , glass case. -t erminals: solderable per mil-std-750, method 2026. -polarity: indicated by cathode band. -approx. weight: 0.05 grams CDSL4148-G/4448-g maximum ratings and electrical characteristics (at t a=25c unless otherwise noted) d i m e n s i o n s i n i n c h e s a n d ( m i l l i m e t e r ) qw -b0012 comchip t echnology co., l td. repetitive peak reverse voltage reverse voltage forward current a veraged forward current peak surge forward current power dissipation maximum forward voltage maximum reverse current maximum reverse recovery time t ypical diode capacitance maximum junction temperature storage temperature units symbol parameter v rrm v r i fm i o i fsm p d v f i r t rr c j t j t stg conditions cdsl4448-g t=1.0 s @i f =5ma @i f =10ma @i f =100ma @v r =75v @v r =25v i f =10ma, r l =50 , v r =6v v r =0v , f=1.0mhz 75 75 300 500 150 2 500 - 0.72 1 - - 1 2.5 0.025 4 4 175 -65 to +175 v v ma ma a mw v a ns pf c c m i n i m e l f ( s o d - 8 0 ) CDSL4148-G 0.020(0.50) 0.012(0.30) 0.063(1.60) 0.055(1.40) 0.146(3.70) 0.134(3.40)
qw -b0012 ra ting and characteristic cur ves (CDSL4148-G/4448-g) forward v oltage, (v) 1.5 1.0 0.5 0 fig.1 - forward characteristics 1 10 100 1000 f r a d u r e n t , ( m a ) o w r c r reverse v oltage, (v) 0 fig.2 reverse characteristics - 0.1n e e s e c r r e n t , ( a ) r v r u 1n 10n 100n 10 40 reverse v oltage, (v) 0 fig.3 capacitance between t erminals - characteristics 0 c a p a c t a c b e t e e n t e r m i n l s , ( p f ) i n e w a 1 2 30 50 ambient t emperature, (c) fig.4 power derating curve - 0 p o w e r d i s s i p a t i o n , ( m w ) 300 600 comchip t echnology co., l td. page 2 rev :b 60 100 0 100 175 20 80 200 10 25 50 75 150 125 400 1 40 20 s m a l l s i g n a l s w i t c h i n g d i o d e s t a =125c t a =-40c t a =25c t a =75c t j =25c f=1mhz 100 500 mounted on glass epoxy pcbs t a =150c t a =-40c t a =25c t a =75c
qw -b0012 comchip t echnology co., l td. page 3 rev :b s m a l l s i g n a l s w i t c h i n g d i o d e s b c d d d 2 d 1 e f p p 0 p 1 m i n i - m e l f s y m b o l a ( m m ) ( i n c h ) 0 . 0 7 9 m a x . 0 . 1 5 4 m a x . 0 . 0 7 9 m a x . 0 . 0 6 1 0 . 0 0 4 7 . 0 0 8 0 . 0 4 0 . 5 1 2 0 . 0 0 8 m i n i - m e l f s y m b o l ( m m ) ( i n c h ) 0 . 0 6 9 0 . 0 0 4 0 . 1 3 8 0 . 0 0 2 0 . 1 5 7 0 . 0 0 4 0 . 1 5 7 0 . 0 0 4 0 . 0 7 9 0 . 0 0 2 2 . 0 0 m a x . 3 . 9 0 m a x . 4 . 0 0 0 . 1 0 1 . 5 5 0 . 1 0 3 . 5 0 0 . 0 5 1 . 7 5 0 . 1 0 1 3 . 0 0 . 2 0 2 . 0 0 m a x . 4 . 0 0 0 . 1 0 2 . 0 0 0 . 0 5 1 7 8 1 5 0 . 0 m i n . 1 . 9 6 9 m i n . w w 1 0 . 3 1 5 0 . 0 1 2 0 . 5 6 7 m a x . 8 . 0 0 0 . 3 0 1 4 . 4 m a x . reel t aping specification o 1 2 0 t railer device leader 10 pitches (min) 10 pitches (min) ....... ....... ....... ....... ....... ....... ....... ....... end start d 1 d 2 d w 1 t c direction of feed i n d e x h o l e d e f b w p p 0 p 1 a
qw -b0012 comchip t echnology co., l td. page 4 rev :b s m a l l s i g n a l s w i t c h i n g d i o d e s suggested p ad layout size (inch) 0.134 (mm) 3.40 1.30 1.70 0.051 0.067 mini-melf 4.70 0.185 e 2.10 0.083 standard packaging mini-melf a b c d a c b e d c a s e t y p e 2 , 5 0 0 r e e l ( p c s ) reel size (inch) 7 r e e l p a c k
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